EAIST1005A0 preliminary features ? high reliability ? small double - end package ? compatible with infrared and vapor phase reflow solder process. ? pb free ? the product itself will remain within rohs compliant version. description ? eaist1005 is an infrared emitting diode in miniature smd package which is molded in a water clear epoxy . the device is spectrally matched with silicon photo-diode and photo-transistor. applications ? pcb mounted infrared sensor ? infrared remote control units with high power requirement ? scanner ? infrared applied system device selection guide device no. chip material lens color EAIST1005A0 gaalas water clear page 1 of 8 rev. 0.01
package dimensions notes: 1.all dimensions are in millimeters 2.tolerances unless dimensions 0.1mm absolute maximum ratings (ta=25 ) parameter symbol rating units continuous forward current i f 50 ma reverse voltage v r 5 v operating temperature t opr - 40 ~ +85 storage temperature t stg - 40 ~ + 100 soldering temperature t sol 260 power dissipation at(or below) 25 free air temperature p d 1 00 mw * soldering time Q 5 seconds. datasheet EAIST1005A0 page 2 of 8 rev. 0.01
electro - optical characteristics (ta=25 ) parameter symbol min. typ. max. unit condition radiant intensity i e -- 2.35 -- mw /sr i f =20ma peak wavelength p -- 940 -- nm i f =20ma spectral bandwidth ? -- 45 -- nm i f =20ma forward voltage v f -- 1. 5 1. 9 v i f =20ma reverse current i r -- -- 10 a v r =5v view angle 2 1/2 -- 120 -- deg i f =20ma datasheet EAIST1005A0 page 3 of 8 rev. 0.01
typical electrical/optical/characteristics curves for ir relative intensity vs. forward current forward current vs. forward voltage ` spectral distribution 0 5 10 15 20 25 30 35 40 45 50 55 60 65 0 1 2 3 4 5 6 7 radiant intensity (mw/sr) forward current (ma) 1 10 100 1.0 1.2 1.4 1.6 1.8 2.0 forward voltage v f (v) forward current i f (ma) ta=25 o c 700 800 900 1000 1100 0.0 0.2 0.4 0.6 0.8 1.0 relative radiant intensity (%) wavelength (nm) datasheet EAIST1005A0 page 4 of 8 rev. 0.01
relative radiant intensity vs. angular displacement 0 30 60 90 -90 -60 -30 0 0.0 0.2 0.4 0.6 0.8 1.0 reletive radiant intensity view angle(degree) datasheet EAIST1005A0 page 5 of 8 rev. 0.01
precautions for use 1. over-current-proof customer must apply resistors for protection , otherwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package, the leds should be kept at 30 or less and 90%rh or less. 2.3 the leds should be used within a year. 2.4 after opening the package, the leds should be kept at 30 or less and 60%rh or less. 2.5 the leds should be used within 168 hours (7 days) after opening the package. 2.6 if the moisture absorbent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 605 for min. 24 hours. 3. soldering condition 3.1 pb-free solder temperature profile 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. datasheet EAIST1005A0 page 6 of 8 rev. 0.01
4. soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. be careful because the damage of the product is often started at the time of the hand solder. 5. repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double -head soldering iron should be used (as below figure). it should be confirmed beforehand whether the characteristics of the leds will or will not be damaged by repairing. datasheet EAIST1005A0 page 7 of 8 rev. 0.01
packing procedure label form specification cpn: customers production number p/n : production number qty: packing quantity cat: ranks hue: peak wavelength ref: reference lot no: lot number made in taiwan: production place notes 1. above specification may be changed without notice. everlight will reserve authority on material change for above specification. 2. when using this product, please observe the absolute maximum ratings and the instructions for using outlined in these specification sheets. everlight assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets. 3. these specification sheets include materials protected under copyright of everlight corporation. please dont reproduce or cause anyone to reproduce them without everlights consent. xxxxxxxxxxxxxxxxxxxx xxxxxxxxxx xxxxxxxxxx - xxxxxxxxxx - xxxxxxxxxx xxxxxxxxxx xxxxxxxxxx btpyymmddxxxxx made in xxxxxx msl - x x aluminum moistue-proof bag label desiccant label datasheet EAIST1005A0 page 8 of 8 rev. 0.01
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